100122DC vs 100122F feature comparison

100122DC National Semiconductor Corporation

Buy Now Datasheet

100122F YAGEO Corporation

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP PHILIPS COMPONENTS
Package Description DIP, DIP24,.4 ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 100K 100K
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0
Logic IC Type BUFFER BUFFER
Number of Functions 9 9
Number of Inputs 1 1
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Output Characteristics OPEN-EMITTER OPEN-EMITTER
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 96 mA 96 mA
Prop. Delay@Nom-Sup 1.6 ns
Propagation Delay (tpd) 1.6 ns 1.6 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 5.715 mm
Surface Mount NO NO
Technology ECL ECL
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm
Base Number Matches 3 1
Load Capacitance (CL) 3 pF
Supply Voltage-Max (Vsup) -4.8 V
Supply Voltage-Min (Vsup) -4.2 V
Supply Voltage-Nom (Vsup) -4.5 V

Compare 100122DC with alternatives

Compare 100122F with alternatives