100122DC
vs
100122F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
PHILIPS COMPONENTS
Package Description
DIP, DIP24,.4
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
100K
100K
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
Logic IC Type
BUFFER
BUFFER
Number of Functions
9
9
Number of Inputs
1
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
96 mA
96 mA
Prop. Delay@Nom-Sup
1.6 ns
Propagation Delay (tpd)
1.6 ns
1.6 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
5.715 mm
Surface Mount
NO
NO
Technology
ECL
ECL
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
Base Number Matches
3
1
Load Capacitance (CL)
3 pF
Supply Voltage-Max (Vsup)
-4.8 V
Supply Voltage-Min (Vsup)
-4.2 V
Supply Voltage-Nom (Vsup)
-4.5 V
Compare 100122DC with alternatives
Compare 100122F with alternatives