100122DC
vs
SY100S322DC
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MICREL INC
Package Description
DIP, DIP24,.4
DIP, DIP24,.4
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
100K
100S
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Logic IC Type
BUFFER
BUFFER
Number of Functions
9
9
Number of Inputs
1
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.4
DIP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
96 mA
55 mA
Prop. Delay@Nom-Sup
1.6 ns
0.9 ns
Propagation Delay (tpd)
1.6 ns
0.9 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
5.715 mm
5.84 mm
Surface Mount
NO
NO
Technology
ECL
ECL
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
10.16 mm
Base Number Matches
3
1
Part Package Code
DIP
Pin Count
24
Length
30.605 mm
Compare 100122DC with alternatives
Compare SY100S322DC with alternatives