10131F vs 10H531/BEAJC feature comparison

10131F YAGEO Corporation

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10H531/BEAJC Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature WITH ADDITIONAL COMMON CLOCK
Family 10K
JESD-30 Code R-CDIP-T16 R-XDIP-T16
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -30 °C -55 °C
Output Characteristics OPEN-EMITTER
Output Polarity COMPLEMENTARY
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 5 ns
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology ECL ECL
Temperature Grade OTHER MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE MASTER-SLAVE
fmax-Min 160 MHz
Base Number Matches 4 3
Rohs Code No
JESD-609 Code e0
Max Frequency@Nom-Sup 250000000 Hz
Package Equivalence Code DIP16,.3
Power Supply Current-Max (ICC) 62 mA
Screening Level 38535Q/M;38534H;883B
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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