1N3030C-1
vs
1N3030C-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
14 Weeks
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
35 Ω
|
|
| JESD-30 Code |
O-LALF-W2
|
|
| JESD-609 Code |
e0
|
e0
|
| Knee Impedance-Max |
750 Ω
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
1 W
|
|
| Reference Voltage-Nom |
27 V
|
|
| Reverse Current-Max |
10 µA
|
|
| Reverse Test Voltage |
20.6 V
|
|
| Surface Mount |
NO
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Voltage Temp Coeff-Max |
25.92 mV/°C
|
|
| Voltage Tol-Max |
2%
|
|
| Working Test Current |
9.5 mA
|
|
| Base Number Matches |
4
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
|
|
|
Compare 1N3030C-1 with alternatives
Compare 1N3030C-1 with alternatives