1N3045B-1
vs
JAN1N3045BUR-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED, GLASS PACKAGE-1
|
DO-213AB, 2 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
14 Weeks
|
20 Weeks
|
| Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
450 Ω
|
|
| JEDEC-95 Code |
DO-41
|
DO-213AB
|
| JESD-30 Code |
O-LALF-W2
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
1 W
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Reference Voltage-Nom |
110 V
|
110 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WRAP AROUND
|
| Terminal Position |
AXIAL
|
END
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
2.3 mA
|
2.3 mA
|
| Base Number Matches |
4
|
1
|
| Moisture Sensitivity Level |
|
1
|
| Reference Standard |
|
MIL-19500/115K
|
|
|
|
Compare 1N3045B-1 with alternatives
Compare JAN1N3045BUR-1 with alternatives