1N5294 vs CH1N5294 feature comparison

1N5294 Knox Semiconductor Inc

Buy Now Datasheet

CH1N5294 Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer KNOX SEMICONDUCTORS INC MICROSEMI CORP
Package Description GLASS PACKAGE-2 DIE-1
Reach Compliance Code unknown unknown
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type CURRENT REGULATOR DIODE CURRENT REGULATOR DIODE
Dynamic Impedance-Min 1150000 Ω
JEDEC-95 Code DO-7
JESD-30 Code O-LALF-W2 S-XUUC-N1
JESD-609 Code e0 e3
Knee Impedance-Max 335000 Ω 335000 Ω
Limiting Voltage-Max 1.2 V 1.2 V
Number of Elements 1 1
Number of Terminals 2 1
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND SQUARE
Package Style LONG FORM UNCASED CHIP
Power Dissipation-Max 0.5 W 0.475 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/463
Regulation Current-Nom (Ireg) 0.75 mA 0.75 mA
Rep Pk Reverse Voltage-Max 100 V 100 V
Surface Mount NO YES
Technology FIELD EFFECT FIELD EFFECT
Terminal Finish TIN LEAD TIN
Terminal Form WIRE NO LEAD
Terminal Position AXIAL UPPER
Base Number Matches 24 1
Part Package Code DIE
Pin Count 1
ECCN Code EAR99
HTS Code 8541.10.00.40

Compare CH1N5294 with alternatives