1N5619 vs JANKCB1N5619 feature comparison

1N5619 Microchip Technology Inc

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JANKCB1N5619 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS, A, 2 PIN HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN
Reach Compliance Code compliant unknown
Factory Lead Time 24 Weeks
Samacsys Manufacturer Microchip
Additional Feature HIGH RELIABILITY, METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C
Output Current-Max 1 A 1 A
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 600 V 600 V
Reverse Recovery Time-Max 0.25 µs 0.25 µs
Surface Mount NO NO
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 16 1
Part Package Code DO-7
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.80
Application GENERAL PURPOSE
Forward Voltage-Max (VF) 1.2 V
JEDEC-95 Code DO-7
Non-rep Pk Forward Current-Max 50 A
Reference Standard MIL-19500/429J

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