3D3523-50
vs
SI4463-BXX-FM
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
DATA DELAY DEVICES INC
|
SILICON LABORATORIES INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
HVQCCN,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDIP-T14
|
|
| Length |
19.305 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.57 mm
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Telecom IC Type |
MANCHESTER ENCODER/DECODER
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 3D3523-50 with alternatives
Compare SI4463-BXX-FM with alternatives