5534A/BPA vs SE5534T feature comparison

5534A/BPA NXP Semiconductors

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SE5534T Philips Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SIGNETICS CORP
Part Package Code DIP
Package Description DIP, ,
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 1.5 µA 1.5 µA
Common-mode Reject Ratio-Nom 100 dB 100 dB
Input Offset Voltage-Max 3000 µV 3000 µV
JESD-30 Code R-GDIP-T8 O-MBCY-W8
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED METAL
Package Code DIP
Package Shape RECTANGULAR ROUND
Package Style IN-LINE CYLINDRICAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Slew Rate-Nom 13 V/us 13 V/us
Supply Current-Max 9 mA
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE WIRE
Terminal Pitch 2.54 mm
Terminal Position DUAL BOTTOM
Unity Gain BW-Nom 10000 10000
Width 7.62 mm
Base Number Matches 2 3
Neg Supply Voltage Limit-Max -22 V
Supply Voltage Limit-Max 22 V

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