553MI vs ICS553MI feature comparison

553MI Integrated Device Technology Inc

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ICS553MI Integrated Circuit Systems Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED CIRCUIT SYSTEMS INC
Part Package Code SOIC
Package Description 0.150 INCH, SOIC-8 0.150 INCH, SOIC-8
Pin Count 8
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
Family 553
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e0
Length 4.9 mm 4.9 mm
Logic IC Type LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER
Max I(ol) 0.035 A 0.035 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 8 8
Number of True Outputs 4 4
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 5 ns 5 ns
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.05 ns 0.05 ns
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 3.9 mm 3.9 mm
fmax-Min 200 MHz 200 MHz
Base Number Matches 1 2
Additional Feature CAN ALSO BE OPERATED WITH A 3.3V OR 5V SUPPLY

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