5962-8753902LA vs 5962-8867002LA feature comparison

5962-8753902LA QP Semiconductor

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5962-8867002LA Teledyne e2v

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Part Life Cycle Code Transferred Active
Ihs Manufacturer QP SEMICONDUCTOR INC TELEDYNE E2V (UK) LTD
Package Description DIP-24 DIP, DIP24,.3
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
Clock Frequency-Max 25 MHz 25 MHz
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 31.877 mm 31.877 mm
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Programmable Logic Type UV PLD OT PLD
Propagation Delay 30 ns 30 ns
Qualification Status Not Qualified Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 6 4
Architecture PAL-TYPE
Number of Inputs 22
Number of Outputs 10
Number of Product Terms 132
Package Equivalence Code DIP24,.3
Screening Level 38535Q/M;38534H;883B

Compare 5962-8753902LA with alternatives

Compare 5962-8867002LA with alternatives