5962-8984101LA vs 5962-8984101LX feature comparison

5962-8984101LA Lattice Semiconductor Corporation

Buy Now Datasheet

5962-8984101LX AMD

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description CERAMIC, DIP-24 DIP,
Pin Count 24 24
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1 EXTERNAL CLOCK; REGISTER PRELOAD PAL WITH MACROCELLS; 10 MACROCELLS
Architecture PAL-TYPE
Clock Frequency-Max 22 MHz 22 MHz
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Length 31.877 mm 31.9405 mm
Moisture Sensitivity Level 1
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Inputs 22
Number of Outputs 10
Number of Product Terms 132
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type EE PLD EE PLD
Propagation Delay 30 ns 30 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

Compare 5962-8984101LA with alternatives

Compare 5962-8984101LX with alternatives