5P83904PGGK8
vs
5P83908NDGK8
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
TSSOP
|
VFQFPN
|
| Pin Count |
16
|
20
|
| Manufacturer Package Code |
PGG16
|
NDG20P2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
NLR
|
NLR
|
| HTS Code |
8542390001
|
8542390001
|
| Factory Lead Time |
26 Weeks, 1 Day
|
26 Weeks, 1 Day
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| Additional Feature |
IT ALSO OPERATES AT 2.5V AND 3.3V NOMINAL SUPPLY
|
IT ALSO OPERATES AT 2.5V AND 3.3V NOMINAL SUPPLY
|
| JESD-30 Code |
R-PDSO-G16
|
S-XQCC-N20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Clock Frequency-Max |
25 MHz
|
25 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Primary Clock/Crystal Frequency-Nom |
40 MHz
|
40 MHz
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Max |
1.89 V
|
1.89 V
|
| Supply Voltage-Min |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin (Sn)
|
TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
3 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, OTHER
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 5P83904PGGK8 with alternatives
Compare 5P83908NDGK8 with alternatives