70T3539MS133BCGI vs IDT70T3539MS133BCGI feature comparison

70T3539MS133BCGI Integrated Device Technology Inc

Buy Now Datasheet

IDT70T3539MS133BCGI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Package Description 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 LBGA, BGA256,16X16,40
Pin Count 256 256
Manufacturer Package Code BCG256
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Memory Density 18874368 bit 18874368 bit
Memory IC Type APPLICATION SPECIFIC SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 256 256
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX36 512KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.025 A 0.025 A
Standby Voltage-Min 2.4 V 2.4 V
Supply Current-Max 0.9 mA 0.9 mA
Supply Voltage-Max (Vsup) 2.6 V 2.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 1
Length 17 mm
Seated Height-Max 1.5 mm
Width 17 mm

Compare 70T3539MS133BCGI with alternatives

Compare IDT70T3539MS133BCGI with alternatives