72225LB10TFG8 vs IDT72225LB10TF9 feature comparison

72225LB10TFG8 Renesas Electronics Corporation

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IDT72225LB10TF9 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP QFP
Pin Count 64 64
Manufacturer Package Code PPG64
Reach Compliance Code compliant compliant
ECCN Code NLR EAR99
HTS Code 8542320071 8542.32.00.71
Factory Lead Time 26 Weeks, 1 Day
Samacsys Manufacturer Renesas Electronics
Access Time-Max 6.5 ns 40 ns
Cycle Time 10 ns 50 ns
JESD-30 Code R-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Memory Density 18432 bit 18432 bit
Memory IC Type BI-DIRECTIONAL FIFO OTHER FIFO
Memory Width 18 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 1024 words 1024 words
Number of Words Code 1000 2000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX18 2KX9
Output Enable YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR SQUARE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Supply Current-Max 0.06 mA 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
Package Description LFQFP,
Length 10 mm
Package Code LFQFP
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Seated Height-Max 1.6 mm
Terminal Pitch 0.5 mm
Width 10 mm

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