72225LB10TFG8
vs
IDT72V225L10TF
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TQFP
|
QFP
|
| Pin Count |
64
|
64
|
| Manufacturer Package Code |
PPG64
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
NLR
|
EAR99
|
| HTS Code |
8542320071
|
8542.32.00.71
|
| Factory Lead Time |
26 Weeks, 1 Day
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Access Time-Max |
6.5 ns
|
6.5 ns
|
| Cycle Time |
10 ns
|
10 ns
|
| JESD-30 Code |
R-PQFP-G64
|
S-PQFP-G64
|
| JESD-609 Code |
e3
|
e0
|
| Memory Density |
18432 bit
|
18432 bit
|
| Memory IC Type |
BI-DIRECTIONAL FIFO
|
OTHER FIFO
|
| Memory Width |
18
|
18
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
1000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1KX18
|
1KX18
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.005 A
|
0.005 A
|
| Supply Current-Max |
0.06 mA
|
0.03 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
4
|
| Package Description |
|
LFQFP, QFP64,.47SQ,20
|
| Additional Feature |
|
EASILY EXPANDABLE IN DEPTH AND WIDTH
|
| Clock Frequency-Max (fCLK) |
|
100 MHz
|
| Length |
|
10 mm
|
| Package Code |
|
LFQFP
|
| Package Equivalence Code |
|
QFP64,.47SQ,20
|
| Package Style |
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Seated Height-Max |
|
1.6 mm
|
| Terminal Pitch |
|
0.5 mm
|
| Width |
|
10 mm
|
|
|
|
Compare 72225LB10TFG8 with alternatives
Compare IDT72V225L10TF with alternatives