72T7295L4-4BB
vs
IDT72T7295L4-4BBG
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
PBGA
|
BGA
|
| Pin Count |
324
|
324
|
| Manufacturer Package Code |
BB324
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
NLR
|
EAR99
|
| HTS Code |
8542320071
|
8542.32.00.71
|
| Factory Lead Time |
26 Weeks, 1 Day
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Access Time-Max |
3.4 ns
|
3.4 ns
|
| Additional Feature |
ASYNCHRONOUS OPERATION ALSO POSSIBLE
|
ASYNCHRONOUS OPERATION ALSO POSSIBLE
|
| Clock Frequency-Max (fCLK) |
225 MHz
|
225 MHz
|
| Cycle Time |
4.44 ns
|
4.44 ns
|
| JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
| JESD-609 Code |
e0
|
e1
|
| Length |
19 mm
|
19 mm
|
| Memory Density |
2359296 bit
|
2359296 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
72
|
72
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
324
|
324
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
32KX72
|
32KX72
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA324,18X18,40
|
BGA324,18X18,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.97 mm
|
1.97 mm
|
| Standby Current-Max |
0.05 A
|
0.02 A
|
| Supply Current-Max |
0.06 mA
|
0.13 mA
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
19 mm
|
19 mm
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
BGA, BGA324,18X18,40
|
|
|
|
Compare 72T7295L4-4BB with alternatives
Compare IDT72T7295L4-4BBG with alternatives