74AVC1T45GM-Q100
vs
935284154132
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
VSON,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
COMMON CONTROL
|
|
| Count Direction |
BIDIRECTIONAL
|
|
| Family |
AVC
|
AVC
|
| JESD-30 Code |
S-PDSO-N6
|
R-PDSO-N6
|
| Length |
1 mm
|
1.45 mm
|
| Load Capacitance (CL) |
15 pF
|
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Max I(ol) |
0.015 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
VSON
|
| Package Equivalence Code |
SOLCC6,.04,14
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Packing Method |
TR, 7 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
0.012 mA
|
|
| Prop. Delay@Nom-Sup |
9.9 ns
|
|
| Propagation Delay (tpd) |
9.9 ns
|
15.5 ns
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
0.35 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.35 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1 mm
|
1 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e3
|
| Temperature Grade |
|
AUTOMOTIVE
|
|
|
|
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