74HC173DB,112 vs HD74HC173RP-EL feature comparison

74HC173DB,112 NXP Semiconductors

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HD74HC173RP-EL Renesas Electronics Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Part Package Code SSOP1 SOIC
Package Description SSOP, SOP,
Pin Count 16 16
Manufacturer Package Code SOT338-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature WITH HOLD MODE
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 6.2 mm 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 4
Number of Functions 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 53 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE
Width 5.3 mm 3.95 mm
fmax-Min 60 MHz
Base Number Matches 1 2

Compare 74HC173DB,112 with alternatives

Compare HD74HC173RP-EL with alternatives