74VHC125BQ,115
vs
74VHC126BQ-Q100
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
| Part Package Code |
QFN
|
|
| Package Description |
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
|
HVQCCN,
|
| Pin Count |
14
|
|
| Manufacturer Package Code |
SOT762-1
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
AHC/VHC/H/U/V
|
AHC/VHC/H/U/V
|
| JESD-30 Code |
R-PQCC-N14
|
R-PQCC-N14
|
| Length |
3 mm
|
3 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Propagation Delay (tpd) |
14.5 ns
|
14.5 ns
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
2.5 mm
|
2.5 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| HTS Code |
|
8542.39.00.01
|
| Date Of Intro |
|
2017-02-01
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD SILVER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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