7702402CX vs TC4081BFN(TP2) feature comparison

7702402CX Harris Semiconductor

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TC4081BFN(TP2) Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR TOSHIBA CORP
Package Description DIP, SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Length 19.56 mm 8.65 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level NOT APPLICABLE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Propagation Delay (tpd) 250 ns 200 ns
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Part Package Code SOIC
Pin Count 14
Load Capacitance (CL) 50 pF
Qualification Status Not Qualified

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