7SB3126DTT1G
vs
7SB3126CMX1TCG
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
Part Package Code |
TSOP
|
LGA
|
Package Description |
LEAD FREE, TSOP-5
|
1 X 1 MM, 0.35 MM PITCH, LEAD FREE, ULLGA-6
|
Pin Count |
5
|
6
|
Manufacturer Package Code |
483
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
2 Days
|
4 Weeks
|
Samacsys Manufacturer |
onsemi
|
|
Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
JESD-30 Code |
R-XDSO-G5
|
S-XDSO-N6
|
JESD-609 Code |
e3
|
e4
|
Length |
3 mm
|
1 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
5
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
TSSOP
|
VSON
|
Package Equivalence Code |
TSOP5/6,.11,37
|
SOLCC6,.04,14
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
0.4 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4 V
|
4 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.95 mm
|
0.35 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.5 mm
|
1 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 7SB3126DTT1G with alternatives
Compare 7SB3126CMX1TCG with alternatives