8403615LA
vs
HM4-6516B-9
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
LOGIC DEVICES INC
|
INTERSIL CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
CERAMIC, DIP-24
|
QCCN, LCC32,.45X.55
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
120 ns
|
120 ns
|
| JESD-30 Code |
R-GDIP-T24
|
R-XQCC-N32
|
| Length |
32.004 mm
|
|
| Memory Density |
16384 bit
|
16384 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
|
| Number of Terminals |
24
|
32
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
2KX8
|
2KX8
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DIP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
5
|
3
|
| I/O Type |
|
COMMON
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
LCC32,.45X.55
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.000025 A
|
| Standby Voltage-Min |
|
2 V
|
| Supply Current-Max |
|
0.034 mA
|
|
|
|