935286451115
vs
935286451151
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
TFBGA,
|
TFBGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
80 MHz
|
80 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
0.0000012122176018 MBps
|
0.0000012122176018 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PBGA-B36
|
S-PBGA-B36
|
| JESD-609 Code |
e1
|
e1
|
| Length |
3.5 mm
|
3.5 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
2
|
2
|
| Number of Terminals |
36
|
36
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Seated Height-Max |
1.15 mm
|
1.15 mm
|
| Supply Voltage-Max |
1.95 V
|
1.95 V
|
| Supply Voltage-Min |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
3.5 mm
|
3.5 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 935286451115 with alternatives
Compare 935286451151 with alternatives