AD8591ART-REEL
vs
MCP608I/ST
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOT-23
|
SOIC
|
| Package Description |
LSSOP,
|
TSSOP,
|
| Pin Count |
6
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.00006 µA
|
0.00008 µA
|
| Common-mode Reject Ratio-Nom |
45 dB
|
91 dB
|
| Input Offset Voltage-Max |
30000 µV
|
250 µV
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Length |
2.9 mm
|
4.4 mm
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
260
|
| Seated Height-Max |
1.45 mm
|
1.2 mm
|
| Slew Rate-Nom |
3.5 V/us
|
0.08 V/us
|
| Supply Voltage Limit-Max |
6 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
40
|
| Unity Gain BW-Nom |
2200
|
155
|
| Width |
1.65 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare AD8591ART-REEL with alternatives
Compare MCP608I/ST with alternatives