ADC0804-1CN
vs
ADC0804LCWMX
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
SOIC-20
|
Pin Count |
20
|
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
5.05 V
|
6.35 V
|
Analog Input Voltage-Min |
-0.05 V
|
-0.05 V
|
Conversion Time-Max |
73 µs
|
114 µs
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
R-PDIP-T20
|
R-PDSO-G20
|
Length |
26.695 mm
|
12.8 mm
|
Linearity Error-Max (EL) |
0.39%
|
0.3906%
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP20,.3
|
SOP20,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.06 mm
|
2.642 mm
|
Supply Current-Max |
3.5 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.493 mm
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
ECCN Code |
|
EAR99
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
2A
|
Peak Reflow Temperature (Cel) |
|
220
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ADC0804-1CN with alternatives
Compare ADC0804LCWMX with alternatives