AFS1500-FGG256K
vs
AFS1500-FGG484K
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
1 MM PITCH, GREEN, FBGA-256
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
20 Weeks
|
20 Weeks
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B484
|
JESD-609 Code |
e1
|
e1
|
Length |
17 mm
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of Equivalent Gates |
1500000
|
|
Number of Terminals |
256
|
484
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
1500000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Packing Method |
TRAY
|
TRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
17 mm
|
|
Base Number Matches |
2
|
2
|
Clock Frequency-Max |
|
350 MHz
|
Number of Inputs |
|
223
|
Number of Logic Cells |
|
38400
|
Number of Outputs |
|
223
|
Package Equivalence Code |
|
BGA484,22X22,40
|
|
|
|
Compare AFS1500-FGG256K with alternatives
Compare AFS1500-FGG484K with alternatives