AGL030V5-CSG81
vs
AGL030V5-CSG81YI
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-81
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
8 Weeks
|
|
| JESD-30 Code |
S-PBGA-B81
|
S-PBGA-B81
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Equivalent Gates |
30000
|
30000
|
| Number of Inputs |
66
|
66
|
| Number of Logic Cells |
768
|
768
|
| Number of Outputs |
66
|
66
|
| Number of Terminals |
81
|
81
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
30000 GATES
|
30000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA81,9X9,20
|
BGA81,9X9,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare AGL030V5-CSG81 with alternatives
Compare AGL030V5-CSG81YI with alternatives