AGL400V2-FFGG484
vs
AGL400V5-FCS196
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
ACTEL CORP
|
| Package Description |
BGA,
|
8 X 8 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, CSP-196
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B196
|
| JESD-609 Code |
e1
|
|
| Length |
23 mm
|
8 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
9216
|
9216
|
| Number of Equivalent Gates |
400000
|
400000
|
| Number of Terminals |
484
|
196
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
9216 CLBS, 400000 GATES
|
9216 CLBS, 400000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.44 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.26 V
|
1.575 V
|
| Supply Voltage-Min |
1.14 V
|
1.425 V
|
| Supply Voltage-Nom |
1.2 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
8 mm
|
| Base Number Matches |
2
|
2
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AGL400V2-FFGG484 with alternatives