AGL400V2-FGG256 vs M1AGL250V2-FGG144I feature comparison

AGL400V2-FGG256 Microchip Technology Inc

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M1AGL250V2-FGG144I Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-144
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks 12 Weeks
JESD-30 Code S-PBGA-B256 S-PBGA-B144
JESD-609 Code e1 e1
Length 17 mm 13 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 400000 250000
Number of Inputs 178 97
Number of Logic Cells 9216 6144
Number of Outputs 178 97
Number of Terminals 256 144
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 400000 GATES 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 250 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 13 mm
Base Number Matches 5 1

Compare AGL400V2-FGG256 with alternatives

Compare M1AGL250V2-FGG144I with alternatives