AGL400V2-FGG256I
vs
AGL400V2-FCSG196
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256
|
TFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B196
|
JESD-609 Code |
e1
|
|
Length |
17 mm
|
8 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Equivalent Gates |
400000
|
400000
|
Number of Inputs |
178
|
|
Number of Logic Cells |
9216
|
|
Number of Outputs |
178
|
|
Number of Terminals |
256
|
196
|
Operating Temperature-Max |
100 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
400000 GATES
|
9216 CLBS, 400000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
TFBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
250
|
NOT SPECIFIED
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.8 mm
|
1.2 mm
|
Supply Voltage-Max |
1.575 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
17 mm
|
8 mm
|
Base Number Matches |
1
|
2
|
Number of CLBs |
|
9216
|
|
|
|
Compare AGL400V2-FGG256I with alternatives
Compare AGL400V2-FCSG196 with alternatives