AM29C332GCB vs AM29332GC feature comparison

AM29C332GCB AMD

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AM29332GC AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code PGA PGA
Package Description PGA, CERAMIC, HEAT SINK, PGA-169
Pin Count 169 169
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
External Data Bus Width 32 32
JESD-30 Code S-CPGA-P169 S-CPGA-P169
JESD-609 Code e0 e0
Length 44.704 mm 44.704 mm
Number of Terminals 169 169
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA HPGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.953 mm 10.668 mm
Supply Current-Max 70 mA 1800 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS TTL
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 44.704 mm 44.704 mm
uPs/uCs/Peripheral ICs Type BIT-SLICE MICROPROCESSOR BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches 1 2

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