APA300-BGG456 vs APA300-BG456I feature comparison

APA300-BGG456 Microchip Technology Inc

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APA300-BG456I Microchip Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-456 1.27 MM PITCH, PLASTIC, BGA-456
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 26 Weeks 26 Weeks
Clock Frequency-Max 180 MHz 180 MHz
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 300000 300000
Number of Inputs 290 290
Number of Logic Cells 8192 8192
Number of Outputs 290 290
Number of Terminals 456 456
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 300000 GATES 300000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,26X26,50 BGA456,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Packing Method TRAY TRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 2.54 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 6 2
Samacsys Manufacturer Microchip
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 20

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