AR1100-I/SS
vs
AR1100T-I/MQ
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SSOP
|
QFN
|
Package Description |
SSOP-20
|
5 X 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, QFN-20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Additional Feature |
ALSO OPERATES AT 5V SUPPLY
|
ALSO OPERATES AT 5V SUPPLY
|
JESD-30 Code |
R-PDSO-G20
|
S-PQCC-N20
|
JESD-609 Code |
e3
|
e3
|
Length |
7.2 mm
|
5 mm
|
Moisture Sensitivity Level |
2
|
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
HVQCCN
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
2 mm
|
1 mm
|
Supply Voltage-Max |
3.465 V
|
3.465 V
|
Supply Voltage-Min |
3.135 V
|
3.135 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
5.3 mm
|
5 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
LCC20,.20SQ,25
|
|
|
|
Compare AR1100-I/SS with alternatives
Compare AR1100T-I/MQ with alternatives