AT17C256-10JI
vs
XC17256EPC20C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
XILINX INC
Part Package Code
QLCC
QLCC
Package Description
PLASTIC, LCC-20
PLASTIC, LCC-20
Pin Count
20
20
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
55 ns
Clock Frequency-Max (fCLK)
12.5 MHz
15 MHz
JESD-30 Code
S-PQCC-J20
S-PQCC-J20
JESD-609 Code
e0
e0
Length
8.9662 mm
8.9662 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
2
3
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
256KX1
256KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC20,.4SQ
LDCC20,.4SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
4.572 mm
Standby Current-Max
0.00015 A
0.00005 A
Supply Current-Max
0.01 mA
0.01 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
8.9662 mm
8.9662 mm
Base Number Matches
2
1
Factory Lead Time
4 Weeks
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
I/O Type
COMMON
Time@Peak Reflow Temperature-Max (s)
30
Compare AT17C256-10JI with alternatives
Compare XC17256EPC20C with alternatives