AT30TS74-U1FMDB-T
vs
AT30TS74-U1FMEB-T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
10 Weeks
|
|
Date Of Intro |
2017-02-24
|
2017-02-24
|
Samacsys Manufacturer |
Microchip
|
|
Accuracy-Max (Cel) |
3 Cel
|
3 Cel
|
Body Height |
0.295 mm
|
0.295 mm
|
Housing |
PLASTIC
|
PLASTIC
|
JESD-609 Code |
e1
|
e1
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Bits |
12
|
12
|
Number of Terminals |
5
|
5
|
Operating Current-Max |
0.8 mA
|
0.8 mA
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Equivalence Code |
BGA5,3X3,14/8
|
BGA5,3X3,14/8
|
Package Shape/Style |
RECTANGULAR
|
RECTANGULAR
|
Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
1.7 V
|
1.7 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Termination Type |
SOLDER
|
SOLDER
|
Base Number Matches |
1
|
1
|
Package Description |
|
WLCSP-5
|
|
|
|