AT30TS74-U1FMDB-T vs AT30TS74-U1FMEB-T feature comparison

AT30TS74-U1FMDB-T Microchip Technology Inc

Buy Now Datasheet

AT30TS74-U1FMEB-T Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 10 Weeks
Date Of Intro 2017-02-24 2017-02-24
Samacsys Manufacturer Microchip
Accuracy-Max (Cel) 3 Cel 3 Cel
Body Height 0.295 mm 0.295 mm
Housing PLASTIC PLASTIC
JESD-609 Code e1 e1
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Bits 12 12
Number of Terminals 5 5
Operating Current-Max 0.8 mA 0.8 mA
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Interface Type 2-WIRE INTERFACE 2-WIRE INTERFACE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Equivalence Code BGA5,3X3,14/8 BGA5,3X3,14/8
Package Shape/Style RECTANGULAR RECTANGULAR
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 1.7 V 1.7 V
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Termination Type SOLDER SOLDER
Base Number Matches 1 1
Package Description WLCSP-5