AT30TS74-UFM10-T
vs
TMP1075DGKT
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
Texas Instruments
|
| Accuracy-Max (Cel) |
3 Cel
|
1 Cel
|
| Body Height |
0.499 mm
|
1.07 mm
|
| JESD-609 Code |
e1
|
e4
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Bits |
12
|
12
|
| Operating Current-Max |
0.8 mA
|
0.004 mA
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
| Package Shape/Style |
RECTANGULAR
|
SQUARE
|
| Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
1.7 V
|
1.7 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN SILVER COPPER
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
2
|
2
|
| Body Breadth |
|
3 mm
|
| Body Length or Diameter |
|
3 mm
|
| Housing |
|
PLASTIC
|
| Number of Terminals |
|
8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
|
|
|
Compare AT30TS74-UFM10-T with alternatives
Compare TMP1075DGKT with alternatives