AT88SC1616C-MJ
vs
AT88SC1616C-PI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
MODULE-8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A992.C
|
EAR99
|
| HTS Code |
8523.52.00.90
|
8542.32.00.71
|
| Factory Lead Time |
7 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Access Time-Max |
35 ns
|
|
| JESD-30 Code |
R-XUUC-N8
|
R-PDIP-T8
|
| JESD-609 Code |
e4
|
|
| Memory Density |
16384 bit
|
16384 bit
|
| Memory IC Type |
CRYPTO MEMORY
|
CRYPTO MEMORY
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
2KX8
|
2KX8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
DIP
|
| Package Equivalence Code |
DIE OR CHIP
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Nickel/Gold (Ni/Au)
|
|
| Terminal Form |
UNSPECIFIED
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Length |
|
9.271 mm
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
5.334 mm
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare AT88SC1616C-MJ with alternatives
Compare AT88SC1616C-PI with alternatives