ATSAM3S1CB-AU vs ATSAM3S1CA-CU feature comparison

ATSAM3S1CB-AU Atmel Corporation

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ATSAM3S1CA-CU Microchip Technology Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer ATMEL CORP MICROCHIP TECHNOLOGY INC
Part Package Code QFP
Package Description 14 X 14 MM, 0.50 MM PITCH, GREEN, MS-026, LQFP-100 TFBGA-100
Pin Count 100
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01
Has ADC YES YES
Address Bus Width 24 24
Bit Size 32 32
CPU Family CORTEX-M3 CORTEX-M3
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels YES YES
DMA Channels YES YES
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G100 S-PBGA-B100
JESD-609 Code e3
Length 14 mm 9 mm
Number of I/O Lines 79 79
Number of Terminals 100 100
On Chip Program ROM Width 32 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP TFBGA
Package Equivalence Code QFP100,.63SQ,20 BGA100,10X10,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 16384 16384
ROM (words) 16384 65536
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.1 mm
Speed 64 MHz 64 MHz
Supply Voltage-Max 1.95 V 1.95 V
Supply Voltage-Min 1.62 V 1.8 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 14 mm 9 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 2
Boundary Scan YES
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
Number of DMA Channels 22
Number of External Interrupts 30
Number of Serial I/Os 5
Number of Timers 7
On Chip Data RAM Width 8

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