ATSAM3S1CB-AU
vs
ATSAM3S1CA-CU
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ATMEL CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
QFP
Package Description
14 X 14 MM, 0.50 MM PITCH, GREEN, MS-026, LQFP-100
TFBGA-100
Pin Count
100
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
24
24
Bit Size
32
32
CPU Family
CORTEX-M3
CORTEX-M3
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
8
8
JESD-30 Code
S-PQFP-G100
S-PBGA-B100
JESD-609 Code
e3
Length
14 mm
9 mm
Number of I/O Lines
79
79
Number of Terminals
100
100
On Chip Program ROM Width
32
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
TFBGA
Package Equivalence Code
QFP100,.63SQ,20
BGA100,10X10,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
RAM (bytes)
16384
16384
ROM (words)
16384
65536
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.1 mm
Speed
64 MHz
64 MHz
Supply Voltage-Max
1.95 V
1.95 V
Supply Voltage-Min
1.62 V
1.8 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
14 mm
9 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
2
2
Boundary Scan
YES
Format
FIXED POINT
Integrated Cache
NO
Low Power Mode
YES
Number of DMA Channels
22
Number of External Interrupts
30
Number of Serial I/Os
5
Number of Timers
7
On Chip Data RAM Width
8
Compare ATSAM3S1CB-AU with alternatives
Compare ATSAM3S1CA-CU with alternatives