BAS716F
vs
BAS1602LE6327XTMA1
feature comparison
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
NEXPERIA
|
INFINEON TECHNOLOGIES AG
|
| Part Package Code |
SOD
|
DFN
|
| Package Description |
R-PDSO-F2
|
R-XBCC-N2
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
SOD523
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
8 Weeks
|
|
| Samacsys Manufacturer |
Nexperia
|
Infineon
|
| Additional Feature |
LOW LEAKAGE CURRENT
|
|
| Application |
GENERAL PURPOSE
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
|
| JESD-30 Code |
R-PDSO-F2
|
R-XBCC-N2
|
| JESD-609 Code |
e3
|
e4
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
4 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
0.2 A
|
0.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Power Dissipation-Max |
0.25 W
|
0.25 W
|
| Reference Standard |
AEC-Q101; IEC-60134
|
AEC-Q101
|
| Rep Pk Reverse Voltage-Max |
85 V
|
85 V
|
| Reverse Current-Max |
0.005 µA
|
|
| Reverse Recovery Time-Max |
3 µs
|
0.004 µs
|
| Reverse Test Voltage |
75 V
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN
|
Gold (Au)
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.70
|
|
|
|
Compare BAS716F with alternatives
Compare BAS1602LE6327XTMA1 with alternatives