BAS716F
vs
BAS416Z
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
NEXPERIA
|
| Part Package Code |
SOD
|
SOD
|
| Package Description |
R-PDSO-F2
|
R-PDSO-G2
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
SOD523
|
SOD323
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
8 Weeks
|
|
| Samacsys Manufacturer |
Nexperia
|
Nexperia
|
| Additional Feature |
LOW LEAKAGE CURRENT
|
|
| Application |
GENERAL PURPOSE
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
|
| JESD-30 Code |
R-PDSO-F2
|
R-PDSO-G2
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
4 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
0.2 A
|
0.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Dissipation-Max |
0.25 W
|
0.25 W
|
| Reference Standard |
AEC-Q101; IEC-60134
|
AEC-Q101; IEC-60134
|
| Rep Pk Reverse Voltage-Max |
85 V
|
85 V
|
| Reverse Current-Max |
0.005 µA
|
|
| Reverse Recovery Time-Max |
3 µs
|
3 µs
|
| Reverse Test Voltage |
75 V
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare BAS716F with alternatives
Compare BAS416Z with alternatives