BCP56-16,135 vs BCP56-10,115 feature comparison

BCP56-16,135 NXP Semiconductors

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BCP56-10,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SC-73 SC-73
Package Description PLASTIC, SC-73, 4 PIN PLASTIC, SC-73, 4 PIN
Pin Count 4 4
Manufacturer Package Code SOT223 SOT223
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75 8541.29.00.75
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 1 A 1 A
Collector-Emitter Voltage-Max 80 V 80 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 100 63
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 1.5 W 1.5 W
Power Dissipation-Max (Abs) 1.35 W 1.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard AEC-Q101; IEC-60134 AEC-Q101; IEC-60134
Surface Mount YES YES
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 180 MHz 180 MHz
Base Number Matches 2 2

Compare BCP56-16,135 with alternatives

Compare BCP56-10,115 with alternatives