BD6529GUL-E2
vs
BQ500412RGZT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
ROHM CO LTD
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOF
|
|
| Package Description |
VFBGA, BGA6,2X3,20
|
VQFN-48
|
| Pin Count |
6
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
Texas Instruments
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PBGA-B6
|
S-PQCC-N48
|
| Length |
1.5 mm
|
7 mm
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
48
|
| Operating Temperature-Max |
85 °C
|
110 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA6,2X3,20
|
LCC48,.27SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.55 mm
|
1 mm
|
| Supply Current-Max (Isup) |
0.03 mA
|
60 mA
|
| Supply Voltage-Max (Vsup) |
4.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
1 mm
|
7 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
3
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare BD6529GUL-E2 with alternatives
Compare BQ500412RGZT with alternatives