BM77SPP03MC2-0004AA
vs
LM961
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
LM TECHNOLOGIES LTD
|
| Package Description |
MODULE-30
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Data Rate |
112 Mbps
|
|
| JESD-30 Code |
R-XXMA-N30
|
R-XXMA-N29
|
| Length |
15 mm
|
18.9 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
30
|
29
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
XMA
|
|
| Package Equivalence Code |
MODULE,30LEAD(UNSPEC)
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
250
|
NOT SPECIFIED
|
| Seated Height-Max |
1.86 mm
|
2.55 mm
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.1 mm
|
1.27 mm
|
| Terminal Position |
UNSPECIFIED
|
UNSPECIFIED
|
| Width |
12 mm
|
12.71 mm
|
| Base Number Matches |
1
|
1
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare BM77SPP03MC2-0004AA with alternatives
Compare LM961 with alternatives