BU4069UBFV-T2
vs
HEF4069UBTT-Q100J
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
NEXPERIA
|
| Part Package Code |
SSOP
|
TSSOP
|
| Package Description |
LSSOP,
|
TSSOP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e2
|
e4
|
| Length |
5 mm
|
5 mm
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Number of Functions |
6
|
6
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.35 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
16 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN COPPER
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
SOT402-1
|
| Factory Lead Time |
|
6 Weeks
|
| Samacsys Manufacturer |
|
Nexperia
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Packing Method |
|
TR, 13 INCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Propagation Delay (tpd) |
|
90 ns
|
| Screening Level |
|
AEC-Q100
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BU4069UBFV-T2 with alternatives
Compare HEF4069UBTT-Q100J with alternatives