BX80546KG3400FU
vs
RK80532KE0831M
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Part Package Code |
PGA
|
PGA
|
Package Description |
HIPGA, PGA604,25X31,50
|
FLIP CHIP, MICRO, PGA2-604
|
Pin Count |
604
|
604
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.1
|
|
HTS Code |
8473.30.11.80
|
8473.30.11.80
|
Address Bus Width |
36
|
36
|
Bit Size |
64
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
200 MHz
|
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CPGA-P604
|
S-CPGA-P604
|
Length |
42.5 mm
|
42.5 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
604
|
604
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
HIPGA
|
SPGA
|
Package Equivalence Code |
PGA604,25X31,50
|
PGA604,25X31,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH
|
GRID ARRAY, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.5 mm
|
|
Speed |
3400 MHz
|
3060 MHz
|
Supply Current-Max |
120000 mA
|
|
Supply Voltage-Max |
1.38 V
|
1.468 V
|
Supply Voltage-Min |
1.28 V
|
1.348 V
|
Supply Voltage-Nom |
1.2 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Width |
42.5 mm
|
42.5 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
4
|
3
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare BX80546KG3400FU with alternatives
Compare RK80532KE0831M with alternatives