BX80546KG3400FU
vs
RK80546KG0882MM
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Part Package Code |
PGA
|
PGA
|
| Package Description |
HIPGA, PGA604,25X31,50
|
HIPGA, PGA604,25X31,50
|
| Pin Count |
604
|
604
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.1
|
3A991.A.1
|
| HTS Code |
8473.30.11.80
|
8473.30.11.80
|
| Address Bus Width |
36
|
36
|
| Bit Size |
64
|
64
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
200 MHz
|
200 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CPGA-P604
|
S-CPGA-P604
|
| Length |
42.5 mm
|
42.5 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
604
|
604
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
HIPGA
|
HIPGA
|
| Package Equivalence Code |
PGA604,25X31,50
|
PGA604,25X31,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH
|
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.5 mm
|
4.5 mm
|
| Speed |
3400 MHz
|
3200 MHz
|
| Supply Current-Max |
120000 mA
|
120000 mA
|
| Supply Voltage-Max |
1.38 V
|
1.38 V
|
| Supply Voltage-Min |
1.28 V
|
1.21 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Width |
42.5 mm
|
42.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
4
|
4
|
| Rohs Code |
|
No
|
|
|
|
Compare BX80546KG3400FU with alternatives
Compare RK80546KG0882MM with alternatives