BZV55C56 vs BZV55C56 feature comparison

BZV55C56 NXP Semiconductors

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BZV55C56 Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description O-LELF-R2 O-LELF-N2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 200 Ω 200 Ω
JESD-30 Code O-LELF-R2 O-LELF-N2
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 56 V 56 V
Reverse Current-Max 0.05 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN TIN LEAD
Terminal Form WRAP AROUND NO LEAD
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max 63.8 mV/°C
Voltage Tol-Max 5% 7.14%
Working Test Current 2 mA 2 mA
Base Number Matches 10 5
Part Package Code DO-34
Manufacturer Package Code CASE 362-03

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Compare BZV55C56 with alternatives