C1812A563K1XAL3325
vs
CDR04BX563BKYSAB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
KEMET ELECTRONICS CORP
|
VISHAY INTERTECHNOLOGY INC
|
| Package Description |
, 1812
|
CHIP
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Capacitance |
0.056 µF
|
0.056 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
2.03 mm
|
2.03 mm
|
| JESD-609 Code |
e0
|
e3
|
| Length |
4.57 mm
|
4.57 mm
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
10%
|
10%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
Bulk
|
BULK
|
| Positive Tolerance |
10%
|
10%
|
| Rated (DC) Voltage (URdc) |
100 V
|
100 V
|
| Size Code |
1812
|
1812
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
BX
|
BX
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn70Pb30) - with Nickel (Ni) barrier
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Width |
3.18 mm
|
3.2 mm
|
| Base Number Matches |
1
|
2
|
| HTS Code |
|
8532.24.00.20
|
| Factory Lead Time |
|
22 Weeks
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Reference Standard |
|
MIL-PRF-55681/1
|
|
|
|
Compare C1812A563K1XAL3325 with alternatives
Compare CDR04BX563BKYSAB with alternatives