C2012X5R0J106M
vs
JMK212BJ106MG-B
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
TDK CORP
|
TAIYO YUDEN CO LTD
|
| Package Description |
CHIP
|
, 0805
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8532.24.00.20
|
8532.24.00.20
|
| Samacsys Manufacturer |
TDK
|
|
| Capacitance |
10 µF
|
10 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| JESD-609 Code |
e3
|
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
6.3 V
|
6.3 V
|
| Size Code |
0805
|
0805
|
| Surface Mount |
YES
|
YES
|
| Temperature Characteristics Code |
X5R
|
X5R
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Base Number Matches |
9
|
1
|
| Manufacturer Series |
|
M
|
| Packing Method |
|
BULK
|
|
|
|
Compare C2012X5R0J106M with alternatives
Compare JMK212BJ106MG-B with alternatives